Peking University, September 24, 2025: Professor Song Bai’s team from the College of Engineering at Peking University has reported a breakthrough in microchannel cooling technology, achieving record-breaking heat dissipation with exceptionally low energy use. Published in Nature Electronics, the study demonstrates an embedded three-layer microfluidic architecture that sets new benchmarks for thermal management in high-power electronics.
Background
Wide-bandgap semiconductors such as gallium nitride (GaN) and silicon carbide (SiC) are driving advances in electric vehicles, communications, and renewable energy. However, their heat flux densities, often at the kilowatt level per square centimeter, exceed conventional cooling limits, creating bottlenecks in device performance and reliability.
Why It Matters
By dissipating 3000 W/cm² heat flux with only 0.9 W/cm² pumping power, this strategy surpasses the 2000 W/cm² limit of most existing cooling methods. It achieves a record-high coefficient of performance (COP) of 13,000, enabling energy-efficient and reliable cooling for next-generation power electronics, RF devices, and data centers.
Figure 1. Jet-enhanced manifold microchannels for embedded chip cooling.
Key Findings
The system can manage extremely high heat fluxes, reaching up to 3,000 W/cm², which is critical for modern high-power devices such as wide-bandgap semiconductors. It achieves these rates with very low energy input, requiring less than 1 W/cm² of pumping power. The cooling structure is embedded directly into the device, creating a compact and efficient solution for applications with high power density. Importantly, the design can be fabricated using standard Micro-Electro-Mechanical Systems (MEMS) techniques, making it compatible with existing semiconductor manufacturing and paving the way for future scalability in commercialization.
Figure 2. Basic thermo-hydraulic characterizations and comparisons.
Future Implications
This IC-compatible cooling approach maximizes convective heat transfer without relying on exotic materials. By combining ultra-high flux capability, low power use, and high efficiency, it provides a scalable solution for thermal management in power electronics, data centers, and high-performance computing.
*This article is featured in PKU News "Why It Matters" series. More from this series.
Read more: http://www.nature.com/articles/s41928-025-01449-4
Written by: Akaash Babar
Edited by: Zhang Jiang
Source: PKU News (
Chinese)
